Several experiential linear formulas for antenna pair gain and phase in interfering circumstances are proposed, and a set of design rules is concluded accordingly for on-chip antennas targeting wireless interconnections. 提出了片上天线对传输增益大小及相位在金属干扰环境下的若干线性经验公式,并归纳总结了一套适用于无线互连的片上天线设计规则。
This capacity increases linearly with the increase of antenna pair number. 这个容量随着天线对数的增长而呈现线性增长。
Meanwhile, the dependences of characteristics of integrated antennas applied for wireless interconnect on substrate resistivity, diamond thickness, antenna pair separation and dielectric variety have been studied. It is concluded that thinner diamond layer and higher resistivity substrate are helpful to improve antenna gain. 3. 同时研究了无线互连应用中集成天线的特性对于衬底电阻率、金刚石厚度、天线对间距以及插入不同介质材料等因素的依赖关系,得出了薄的金刚石介质和高电阻率的衬底对提高天线增益有利。
A novel technique for improving on-chip antenna transmission gain is proposed. That is to say, a thin diamond layer is inserted between the silicon substrate and metal heat sink, which enhances the transmission gain of on-chip antenna pair greatly in a wide frequency band. 提出了改进片上天线传输增益的新技术,即在硅衬底和金属散热器之间插入一层薄的金刚石介质材料,使片上天线对的传输增益在较宽的频率范围内有了大幅提高。